• DocumentCode
    2999355
  • Title

    Transmission characteristics of narrow line-width interconnections on silicon substrates

  • Author

    Scott, Craig J.

  • Author_Institution
    US Naval Res. Lab., Washington, DC, USA
  • fYear
    1989
  • fDate
    12-13 Jun 1989
  • Firstpage
    426
  • Lastpage
    431
  • Abstract
    Loss and dispersion characteristics have been investigated for narrow-linewidth 5-μm- and 1-μm-wide Au/Cr microstrip structures on low- and high-resistivity semiconductor substrates. Low-resistivity silicon substrates with narrow microstrip lines exhibit large losses and moderate-to-excessive dispersion, which may render them undesirable for use in large-area, high-speed, VLSI circuits. Alternatively, high-resistivity silicon substrates were found to have significantly lower attenuation and nearly linear phase characteristics for 5-μm linewidths over the 10-GHz frequency range considered. However, for 1-μm linewidths the loss and dispersion characteristics for both high- and low-resistivity substrate microstrip lines may be problematic when used in digital and analog environments where maintaining waveform integrity is of key concern. The data presented should assist in the design and layout of high-speed, large VLSI chips which use small geometry interconnects
  • Keywords
    MMIC; VLSI; chromium alloys; dispersion (wave); gold alloys; integrated circuit technology; losses; metallisation; strip lines; substrates; 1 micron; 10 GHz; 5 micron; Au/Cr microstrip structures; AuCr-Si; IC layout design; MMIC; Si substrates; VLSI circuits; attenuation; dispersion characteristics; high speed digital ICs; high-resistivity semiconductor substrates; linear phase characteristics; loss characteristics; low-resistivity substrate; metallisation; narrow line-width interconnections; small geometry interconnects; Attenuation; Chromium; Frequency; Geometry; Gold; Integrated circuit interconnections; Microstrip; Silicon; Substrates; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Multilevel Interconnection Conference, 1989. Proceedings., Sixth International IEEE
  • Conference_Location
    Santa Clara, CA
  • Type

    conf

  • DOI
    10.1109/VMIC.1989.78004
  • Filename
    78004