DocumentCode
2999355
Title
Transmission characteristics of narrow line-width interconnections on silicon substrates
Author
Scott, Craig J.
Author_Institution
US Naval Res. Lab., Washington, DC, USA
fYear
1989
fDate
12-13 Jun 1989
Firstpage
426
Lastpage
431
Abstract
Loss and dispersion characteristics have been investigated for narrow-linewidth 5-μm- and 1-μm-wide Au/Cr microstrip structures on low- and high-resistivity semiconductor substrates. Low-resistivity silicon substrates with narrow microstrip lines exhibit large losses and moderate-to-excessive dispersion, which may render them undesirable for use in large-area, high-speed, VLSI circuits. Alternatively, high-resistivity silicon substrates were found to have significantly lower attenuation and nearly linear phase characteristics for 5-μm linewidths over the 10-GHz frequency range considered. However, for 1-μm linewidths the loss and dispersion characteristics for both high- and low-resistivity substrate microstrip lines may be problematic when used in digital and analog environments where maintaining waveform integrity is of key concern. The data presented should assist in the design and layout of high-speed, large VLSI chips which use small geometry interconnects
Keywords
MMIC; VLSI; chromium alloys; dispersion (wave); gold alloys; integrated circuit technology; losses; metallisation; strip lines; substrates; 1 micron; 10 GHz; 5 micron; Au/Cr microstrip structures; AuCr-Si; IC layout design; MMIC; Si substrates; VLSI circuits; attenuation; dispersion characteristics; high speed digital ICs; high-resistivity semiconductor substrates; linear phase characteristics; loss characteristics; low-resistivity substrate; metallisation; narrow line-width interconnections; small geometry interconnects; Attenuation; Chromium; Frequency; Geometry; Gold; Integrated circuit interconnections; Microstrip; Silicon; Substrates; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Multilevel Interconnection Conference, 1989. Proceedings., Sixth International IEEE
Conference_Location
Santa Clara, CA
Type
conf
DOI
10.1109/VMIC.1989.78004
Filename
78004
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