Development of EHD ion-drag micropump for microscale electronics cooling

Author

Lee, C.K. ; Robinson, A.J. ; Ching, C.Y.

Author_Institution

Trinity Coll. Dublin, Dublin

fYear

2007

fDate

17-19 Sept. 2007

Firstpage

48

Lastpage

53

Abstract

In this investigation, the numerical simulation of electrohydrodynamic (EHD) ion-drag micropumps with micropillar electrode geometries have been performed. The effect of micropillar height and electrode spacing on the performance of the micropumps was investigated. The performance of the EHD micropump improved with increased applied voltage and decreased electrode spacing. The optimum micropillar height for the micropump with electrode spacing of 40 mum and channel height of 100 mum at 200 V was 40 mum, where a maximum mass flow rate of 0.18g/min was predicted. Compared to that of planar electrodes, the 3D micropillar electrode geometry enhanced the overall performance of the EHD micropumps.

Keywords

cooling; drag; electrohydrodynamics; microelectrodes; microfluidics; micropumps; thermal management (packaging); 3D micropillar electrode geometries; EHD ion-drag micropump performance; channel height; distance 40 mum; electrode spacing; electrohydrodynamics; mass flow rate; microscale electronics cooling; numerical simulation; optimum micropillar height; size 100 mum; voltage 200 V; Dielectrics; Electrodes; Electronics cooling; Geometry; Microelectronics; Microfluidics; Micropumps; Publishing; Pumps; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on

Conference_Location

Budapest

Print_ISBN

978-2-35500-002-7

Type

conf

DOI

10.1109/THERMINIC.2007.4451745

Filename

4451745