DocumentCode :
2999646
Title :
Influence of transparent surface layer on effective thermoreflectance coefficient of typical stacked electronic structures
Author :
Komarov, Pavel L. ; Burzo, Mihai G. ; Raad, Peter E.
Author_Institution :
Southern Methodist Univ., Dallas
fYear :
2007
fDate :
17-19 Sept. 2007
Firstpage :
126
Lastpage :
127
Abstract :
The investigation of the influence of a transparent passivation layer on the effective thermoreflectance coefficient of metallic and semiconductor materials is carried out for two materials and two types of passivation layers. This investigation is targeted at determining the effective Ctr for composite structures typically found in microelectronic devices; namely, transparent passivation layers covering either semiconductor or metallic materials. The layer of poly-Si or gold is deposited on a Si substrate and covered with a layer of either SiO2 or Si3N4. To study the light interference effect on the CTR value of poly-Si and gold films, the thickness of the passivation layer is varied in the range that envelopes the test wavelength of the light source. The experimental values of the effective CTR are obtained with the intent of correlating them with the intrinsic values of CTR for the materials under study (poly-Si and gold) and the thickness and/or material of the transparent passivation layers (SiO2 or Si3N4).
Keywords :
composite materials; gold; integrated circuits; light interference; passivation; silicon compounds; stacking; thermoreflectance; composite structures; effective thermoreflectance coefficient; light interference effect; metallic materials; microelectronic devices; passivation layer; semiconductor materials; stacked electronic structures; transparent surface layer; Composite materials; Gold; Inorganic materials; Interference; Microelectronics; Passivation; Semiconductor materials; Substrates; Testing; Thermoreflectance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
Type :
conf
DOI :
10.1109/THERMINIC.2007.4451760
Filename :
4451760
Link To Document :
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