Challenges in Cu/low-k integration

Advanced BEOL materials matching in chemical, thermal, and mechanical properties remain a challenge to the industry. New failure modes associated with BEOL reliability hinder the mass production of Cu/low-k technology. With 15% IMD effective-K reduction target, low-K, ESL, and metal pitch/height ratio optimization are crucial. Integrated module built-in reliability robustness is to assure stable production. Physical, electrical, reliability, and manufacturability aspects of individual module require full characterization. Implementations of proper queue-time control and iAPC between modules will minimize excursions and increase process window.