Title :
HgCdTe MWIR PECVD SiN passivated photodiodes
Author :
Westerhout, R.J. ; Musca, C.A. ; Sewell, R. ; Antoszewski, J. ; Dell, J.M. ; Faraone, L.
Author_Institution :
Sch. of Electr., Electron. & Comput. Eng., Univ. of Western Australia, Crawley, WA
fDate :
July 28 2008-Aug. 1 2008
Abstract :
To determine a suitable passivation and insulation layer for HgCdTe photodiodes, the properties of various low temperature plasma-enhanced chemical vapour deposition (PECVD) SiN films were investigated. Metal-insulator-metal (MIM) capacitors were fabricated on silicon to determine a suitable PECVD SiN film for insulation of HgCdTe diodes. It was found that PECVD process temperature of 125degC, at high power, and low process pressure gave the best film characteristics. These films were stable in atmosphere, as shown by FTIR measurements, which also shows oxidation of low power, high process pressure films. HgCdTe photodiodes were fabricated with PECVD SiN films with 200 W RF power, 300 mTorr pressure, and a SiN4:NH3:N2 5:45:100 gas ratio. Gated diode measurements indicated that R0A values of 3.0times106 Omega cm2 are achievable with fine-tuning of the SiN charge.
Keywords :
Fourier transform spectra; MIM devices; cadmium compounds; infrared detectors; infrared spectra; mercury compounds; passivation; photodiodes; plasma CVD coatings; semiconductor thin films; silicon compounds; thin film capacitors; FTIR spectrometer; Fourier transform infrared measurement; HgCdTe; MWIR PECVD thick film; N2; SiN; SiN3; gated diode measurement; infrared detector; insulation layer; metal insulator-metal capacitor fabrication; mid-wavelength infrared region; passivated photodiode; plasma-enhanced chemical vapour deposition; power 200 W; pressure 300 mtorr; temperature 125 degC; Chemical vapor deposition; Diodes; Insulation; Metal-insulator structures; Passivation; Photodiodes; Plasma chemistry; Plasma properties; Plasma temperature; Silicon compounds;
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices, 2008. COMMAD 2008. Conference on
Conference_Location :
Sydney, SA
Print_ISBN :
978-1-4244-2716-1
Electronic_ISBN :
1097-2137
DOI :
10.1109/COMMAD.2008.4802096