Chip-level electromigration measurement technique for multi-segmented interconnect test structures

Electromigration life testing of multisegment test structures involves the measurement and analysis of space- and time-variant stress temperature distributions. A technique using the concept of a thermal coupling matrix was developed which allows an accurate (⩽0.5°C) determination of each metal segment temperature during stress test. In the data analysis, each segment failure time is adjusted to the target stress temperature. This results in more accurate values for the calculated electromigration parameters