DocumentCode :
3004525
Title :
Modeling and layout optimization of VLSI devices and interconnects in deep submicron design
Author :
Cong, Jason
Author_Institution :
Dept. of Comput. Sci., Univ. of Southern California, Los Angeles, CA, USA
fYear :
1997
fDate :
28-31 Jan 1997
Firstpage :
121
Lastpage :
126
Abstract :
This paper presents an overview of recent advances on modeling and layout optimization of devices and interconnects for high-performance VLSI circuit design under the deep submicron technology. First, we review a number of interconnect and driver/gate delay models, which are most useful to guide the layout optimization. Then, we summarize the available performance optimization techniques for VLSI device and interconnect layout, including driver and transistor sizing, transistor ordering, interconnect topology optimization, optimal wire sizing, optimal buffer placement, and simultaneous topology construction, buffer insertion, buffer and wire sizing. The efficiency and impact of these techniques will be discussed in the tutorial
Keywords :
VLSI; buffer circuits; circuit layout CAD; circuit optimisation; delays; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; network topology; VLSI devices; buffer insertion; deep submicron design; driver/gate delay models; high-performance VLSI circuit design; interconnect topology optimization; interconnects; layout optimization; optimal buffer placement; optimal wire sizing; simultaneous topology construction; transistor ordering; transistor sizing; Capacitance; Circuit synthesis; Computer science; Delay estimation; Design optimization; Driver circuits; Integrated circuit interconnections; Topology; Very large scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
Conference_Location :
Chiba
Print_ISBN :
0-7803-3662-3
Type :
conf
DOI :
10.1109/ASPDAC.1997.600085
Filename :
600085
Link To Document :
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