DocumentCode :
3004894
Title :
ESD and latch-up reliability for nanometer CMOS technologies
Author :
Duvvury, Charvaka ; Boselli, Gianluca
Author_Institution :
Silicon Technol. Dev., Texas Instrum., Dallas, TX, USA
fYear :
2004
fDate :
13-15 Dec. 2004
Firstpage :
933
Lastpage :
936
Abstract :
Considerable research during the 80´s and 90´s laid the foundation for a deeper understanding of the ESD high current device physics and the subsequent protection design techniques required to achieve ESD reliability for numerous applications (Amerasekera and Duvvury, 2001; Dabral and Maloney,1998). Indeed, at every node a different parameter has had the most influencing effect, especially on ESD. This paper will review the recent trends as the industry moves towards nanometer technologies. New circuit applications are also discussed to introduce the upcoming critical issues for ESD and LU design.
Keywords :
CMOS integrated circuits; electrostatic discharge; integrated circuit reliability; protection; ESD reliability; high current device physics; latch-up reliability; nanometer CMOS technology; protection design techniques; CMOS process; CMOS technology; Conductivity; Doping; Electrostatic discharge; Implants; MOS devices; Merging; Protection; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
Print_ISBN :
0-7803-8684-1
Type :
conf
DOI :
10.1109/IEDM.2004.1419337
Filename :
1419337
Link To Document :
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