DocumentCode :
3007775
Title :
Microfabrication and parallel operation of 5×5 2D AFM cantilever arrays for data storage and imaging
Author :
Lutwyche, M. ; Andreoli, C. ; Binnig, G. ; Brugger, J. ; Drechsler, U. ; Haeberle, W. ; Rohrer, H. ; Rothuizen, H. ; Vettiger, P.
Author_Institution :
Zurich Res. Lab., IBM Res. Div., Ruschlikon, Switzerland
fYear :
1998
fDate :
25-29 Jan 1998
Firstpage :
8
Lastpage :
11
Abstract :
In this paper we report on the microfabrication of a 5×5 2D cantilever array and its successful application to parallel imaging. The 5×5 array with integrated force sensing and tip heating has been fabricated using a recently developed, all dry silicon backside etching process. The levers on the array have integrated piezoresistive sensing. The array is scanned in x and y directions using voice coil actuators. Three additional voice coil z actuators are used in a triangular arrangement to approach the sample with the array chip. The system is thus leveled in the same way as an air table. We report details of the array fabrication, the x-y scanning and approach system as well as images taken with the system
Keywords :
atomic force microscopy; lithography; micromachining; nanotechnology; piezoresistive devices; sputter etching; 2D AFM cantilever arrays; RIE; all dry silicon backside etching; control system; data storage; feedforward signals; integrated force sensing; integrated piezoresistive sensing; microfabrication; micromachining; parallel imaging; parallel operation; patterning; tip heating; triangular arrangement; voice coil actuators; x-y scanning and approach system; Actuators; Atomic force microscopy; Coils; Dry etching; Fabrication; Lithography; Memory; Protection; Resists; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location :
Heidelberg
ISSN :
1084-6999
Print_ISBN :
0-7803-4412-X
Type :
conf
DOI :
10.1109/MEMSYS.1998.659720
Filename :
659720
Link To Document :
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