Title :
1989 Proceedings. Sixth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.89TH0259-2)
Abstract :
The following topics are dealt with: VLSI multilevel interconnection complete process realization; dielectric planarization processes; contact and via fill systems; reliability issues; conductor systems; test structures and modeling; conductor planarization processes; and dielectric systems
Keywords :
VLSI; dielectric thin films; integrated circuit technology; metallisation; reliability; VLSI multilevel interconnection; conductor planarization; conductor systems; contact systems; dielectric planarization; modeling; reliability; test structures; via fill systems;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1989. Proceedings., Sixth International IEEE
Conference_Location :
Santa Clara, CA, USA
DOI :
10.1109/VMIC.1989.78062
