Title :
A modular, high performance, 2 μm CCD-BiCMOS process technology for application specific image sensors and image sensor systems on a chip
Author :
Guidash, R. Michael ; Lee, Paul P K ; Andrus, Jacqueline M. ; Ciccarelli, Antonio S. ; Erhardt, Herbert J. ; Fischer, John R. ; Meisenzahl, Eric J. ; Philbrick, Robert H. ; Ting, Goodwin
Author_Institution :
Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA
Abstract :
A 2 μm BiCMOS process module has been developed for incorporation into existing charge-coupled device (CCD) image sensor processes. The modular process architecture allows integration of CMOS, NPN bipolar or BiCMOS circuits without affecting the baseline CCD characteristics, and enables on-chip integration of desired analog and digital circuit functions with the image sensor. To our knowledge this is the first demonstration of high performance CCD, 2 μm CMOS, and an isolated vertical NPN integrated on the same chip
Keywords :
BiCMOS integrated circuits; CCD image sensors; integrated circuit technology; mixed analogue-digital integrated circuits; 2 micron; CCD-BiCMOS process technology; application specific image sensors; charge-coupled device; isolated vertical NPN device; modular process architecture; onchip image sensor systems; BiCMOS integrated circuits; CMOS image sensors; CMOS process; CMOS technology; Charge coupled devices; Charge-coupled image sensors; Digital circuits; Image sensors; Implants; Standards development;
Conference_Titel :
ASIC Conference and Exhibit, 1994. Proceedings., Seventh Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-2020-4
DOI :
10.1109/ASIC.1994.404542
