A modular, high performance, 2 μm CCD-BiCMOS process technology for application specific image sensors and image sensor systems on a chip

Author

Guidash, R. Michael ; Lee, Paul P K ; Andrus, Jacqueline M. ; Ciccarelli, Antonio S. ; Erhardt, Herbert J. ; Fischer, John R. ; Meisenzahl, Eric J. ; Philbrick, Robert H. ; Ting, Goodwin

Author_Institution

Microelectron. Technol. Dov., Eastman Kodak Co., Rochester, NY, USA

fYear

1994

fDate

19-23 Sep 1994

Firstpage

352

Lastpage

355

Abstract

A 2 μm BiCMOS process module has been developed for incorporation into existing charge-coupled device (CCD) image sensor processes. The modular process architecture allows integration of CMOS, NPN bipolar or BiCMOS circuits without affecting the baseline CCD characteristics, and enables on-chip integration of desired analog and digital circuit functions with the image sensor. To our knowledge this is the first demonstration of high performance CCD, 2 μm CMOS, and an isolated vertical NPN integrated on the same chip

Keywords

BiCMOS integrated circuits; CCD image sensors; integrated circuit technology; mixed analogue-digital integrated circuits; 2 micron; CCD-BiCMOS process technology; application specific image sensors; charge-coupled device; isolated vertical NPN device; modular process architecture; onchip image sensor systems; BiCMOS integrated circuits; CMOS image sensors; CMOS process; CMOS technology; Charge coupled devices; Charge-coupled image sensors; Digital circuits; Image sensors; Implants; Standards development;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Conference and Exhibit, 1994. Proceedings., Seventh Annual IEEE International

Conference_Location

Rochester, NY

Print_ISBN

0-7803-2020-4

Type

conf

DOI

10.1109/ASIC.1994.404542

Filename

404542