• DocumentCode
    3010772
  • Title

    Parylene C and silicone as biocompatible protection encapsulants for PCBs

  • Author

    Bellmann, C. ; Beshchasna, N. ; Uhlemann, J. ; Wolter, K. -J

  • Author_Institution
    Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2009
  • fDate
    13-17 May 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    During the last years a lot of active implantable medical devices like neural prostheses and sensors have been produced. For such systems a long term reliability under the influence of aggressive physiological conditions is very important. To protect them a stiff housing is normally utilised. In some cases, if the requirements for a low weight, flexibility and perhaps a need to transmit optical signals have to be fullfiled, they aren´t the best choice. Another possibility is the use of flexible protection materials like polymers, which have the advantageous properties. Finally their structure isn´t completely impermeable for different components contained in physiological fluids. Some promising polymers are Poly-Para-Xylylen (Parylene C) and silicone rubber (MED6-6606). This paper shows the results of our tests to their ability to function as encapsulants for the PCB configurations FR4+Cu+Ni+Au, FR4+Cu+chem. Sn and FR4+Cu+HAL Sn.
  • Keywords
    biomedical materials; physiology; prosthetics; silicone rubber; PCB configurations; biocompatible protection encapsulants; implantable medical devices; neural prostheses; optical signals; parylene C; physiological fluids; polymers; polyparaxylylen; printed circuit board; protection materials; silicone rubber; Biomedical optical imaging; Biosensors; Implantable biomedical devices; Optical materials; Optical polymers; Optical sensors; Prosthetics; Protection; Rubber; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
  • Conference_Location
    Brno
  • Print_ISBN
    978-1-4244-4260-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2009.5206975
  • Filename
    5206975