• DocumentCode
    3010871
  • Title

    Bipolar ESD power clamp in high voltage CMOS based on TCAD device simulation

  • Author

    Betak, Petr

  • Author_Institution
    Dept. of Microelectron., BUT, Brno, Czech Republic
  • fYear
    2009
  • fDate
    13-17 May 2009
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The paper contributes a specific way to form bipolar ESD power clamp in high voltage CMOS technologies. The CMOS technology cannot use efficient bipolar structures but only the parasitic structures. Here, the functional ESD power clamp is introduced which has higher holding voltage than conventional structures in CMOS. The higher holding voltage is very necessary for power clamps. The structure were formed and simulated in TCAD device simulator and manufactured in high voltage CMOS process.
  • Keywords
    CMOS integrated circuits; bipolar transistor switches; electrostatic devices; electrostatic discharge; power integrated circuits; technology CAD (electronics); BJT switch; TCAD device simulator; bipolar ESD power clamp; bipolar transistor switch; high voltage CMOS technologies; holding voltage; parasitic structures; CMOS process; CMOS technology; Clamps; Electrostatic discharge; Leakage current; Manufacturing processes; Silicon; Switches; Virtual manufacturing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
  • Conference_Location
    Brno
  • Print_ISBN
    978-1-4244-4260-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2009.5206981
  • Filename
    5206981