Abstract :
The following topics are dealt with: polymer cure modelling; electronics packaging; polymer protection device; nanorods; nanotiles; printed circuit board; focused ion beam; magneto-caloric effect; supercapacitors; solder spread factor; conductive polymers; ohmic contact; polarized beam splitting devices; microfluidic systems; capacitive sensor; resonant-tunnelling diode; cell culture measurement device; laser soldering; ageing process; power electronic devices; solder joint mechanical strength; lead-free solder joints; heat pipes; power wire-wound resistors; pyroelectric infrared detectors; electro ultrasonic spectroscopy; failure analysis; electronic oscillators; class E power amplifier; bipolar junction effects; half-bridge inverter; mechatronic system; electro-pneumatic automotive systems; capacitive pressure sensor; system-on-chip devices; microstrip bandpass filters; vibrating wire transducers; MIM structures; web server based remote health monitoring system; surface roughness; blood-borne pathogens; carbon nanotubes; glutathione-coated quantum dots; defect thermal ionisation energies; virtual enterprise network; train spring system diagnostics; conjunctural adaptive system; and digital sinewave generator.
Keywords :
MIM structures; biosensors; carbon nanotubes; cellular biophysics; curing; diseases; infrared detectors; magnetocaloric effects; microfluidics; ohmic contacts; patient monitoring; polymers; power amplifiers; pressure sensors; supercapacitors; surface roughness; system-on-chip; MIM structures; ageing process; bipolar junction effects; blood-borne pathogens; capacitive pressure sensor; capacitive sensor; carbon nanotubes; cell culture measurement device; class E power amplifier; conductive polymers; conjunctural adaptive system; defect thermal ionisation energy; digital sinewave generator; electro ultrasonic spectroscopy; electro-pneumatic automotive systems; electronic oscillators; electronics packaging; failure analysis; focused ion beam; glutathione-coated quantum dots; half-bridge inverter; heat pipes; laser soldering; lead-free solder joints; magneto-caloric effect; mechatronic system; microfluidic systems; microstrip bandpass filters; nanorods; nanotiles; ohmic contact; polarized beam splitting devices; polymer cure modelling; polymer protection device; power electronic devices; power wire-wound resistors; printed circuit board; pyroelectric infrared detectors; resonant-tunnelling diode; solder joint mechanical strength; solder spread factor; supercapacitors; surface roughness; system-on-chip devices; train spring system diagnostics; vibrating wire transducers; virtual enterprise network; web server based remote health monitoring system;
Conference_Titel :
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
Conference_Location :
Brno
Print_ISBN :
978-1-4244-4260-7
DOI :
10.1109/ISSE.2009.5207082
