DocumentCode :
3016515
Title :
Development of a new Love wave liquid sensor operating at 2GHz achieved by electron beam lithography using an integrated micro-flow channel: The liquichip system
Author :
Kirsch, P. ; Assouar, M.B. ; Alnot, P.
Author_Institution :
Lab. de Phys. des Milieux Ionises et Applic., Nancy Univ. - CNRS, Nancy
fYear :
2008
fDate :
2-5 Nov. 2008
Firstpage :
1846
Lastpage :
1849
Abstract :
SAW devices based on waveguide modes with shear horizontal polarization (Love modes) are very promising for sensor applications, especially in liquid media. We present here the realization of a 2 GHz operating frequency sensor based on SiO2/36Y-X LiTaO3 structure with integrated PDMS micro flow channel and using electron beam lithography to realize the submicronic interdigital transducers. Using our developed sensor operating at 2 GHz, we carried out alternate cycles of nitrogen and water circulating in the PDMS micro flow channel. We measured an absolute sensitivity of -19001 Hz.mm2/ng due to the interaction of the sensor with the water. This sensitivity is higher than that of other devices operating at lower frequencies. The detection mechanism, including gravimetric and permittivity effects at high frequency will be discussed.
Keywords :
electron beam lithography; interdigital transducers; lithium compounds; microchannel flow; microsensors; silicon compounds; surface acoustic wave sensors; Love wave liquid sensor; PDMS micro flow channel; SiO2-LiTaO3; electron beam lithography; frequency 2 GHz; gravimetric effect; integrated microflow channel; liquichip system; permittivity effect; shear horizontal polarization; submicronic interdigital transducer; waveguide modes; Electron beams; Frequency; Liquid waveguides; Lithography; Nitrogen; Permittivity measurement; Polarization; Sensor systems; Surface acoustic wave devices; Transducers; Love wave liquid sensors; advanced device integration; high frequencies; micro- flow channel;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
Type :
conf
DOI :
10.1109/ULTSYM.2008.0454
Filename :
4803203
Link To Document :
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