Title :
Experimental study on electrical properties and stability of CNT bumps in high density interconnects
Author :
Yan Zhang ; Ying-jie Zhou ; Jing-yu Fan ; Di Jiang ; Yifeng Fu ; Shi-Wei Ma ; Johan Liu
Author_Institution :
SMIT Center, Shanghai Univ., Shanghai, China
Abstract :
With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to its excellent electrical and thermal conductivities. In the present paper, the application of CNT bundles as chip bumps was experimentally investigated. The electrical resistances of the CNT interconnects were measured, and the thermal and humidity test were conducted. In addition, the CNT forests on fine pitch copper lines under various environmental test conditions were observed to evaluate the stability.
Keywords :
carbon nanotubes; copper; electric resistance measurement; fine-pitch technology; C; CNT bumps; CNT interconnects; Cu; carbon nanotube; chip bumps; electrical property; electrical resistance; electronic packaging; environmental test condition; fine pitch copper lines; high density interconnects; nanomaterials; nanotechnology; thermal conductivity; Carbon nanotubes; Educational institutions; Electrical resistance measurement; Integrated circuit interconnections; Resistance; Scanning electron microscopy; Thermal conductivity;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2013 13th IEEE Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-0675-8
DOI :
10.1109/NANO.2013.6720972
