DocumentCode
3018883
Title
Fabrication of biodegradable polymer microneedle array via CO2 laser ablation
Author
Kun-Tse Tu ; Chen-Kuei Chung
Author_Institution
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2015
fDate
7-11 April 2015
Firstpage
494
Lastpage
497
Abstract
Fabrication of biodegradable polylacticcoglycolic acid (PLGA) microneedle array through CO2 laser processing have been studied and analyzed. The high-aspect-ratio microneedle mold can be obtained using the rapid and low-cost laser processing compared to conventional photolithography and dry etching processes. The laser processing on PDMS results in the problems of scorches and re-solidification. Here, we use the direct-write laser processing microneedle mold structure on PMMA and then perform two-casting PDMS process to form female microneedle mold. Then pour PLGA into PDMS female mold pre-treated by O2 plasma and drying in vacuum chamber. Finally, the complete PLGA microneedle array is released from the PDMS mold which is reusable. The polymer microneedle depth can be from hundreds of micrometers to millimeter that is related to the PMMA structure profile and determined by CO2 laser power and scanning speed. The modified integration of laser processing and molding process is maskless, simple, and low-cost for rapid prototyping.
Keywords
biodegradable materials; biomedical materials; casting; drying; laser ablation; microfabrication; moulding; needles; oxygen; O2; PMMA structure profile; biodegradable polylacticcoglycolic acid microneedle array fabrication; biodegradable polymer microneedle array fabrication; carbon dioxide laser ablation; direct-write laser processing microneedle mold structure; dry etching processes; drying; oxygen plasma; photolithography; rapid prototyping; two-casting PDMS process; vacuum chamber; Arrays; Fabrication; Laser ablation; Laser beams; Polymers; Power lasers; CO2 laser; PLGA; microneedle array;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
Conference_Location
Xi´an
Type
conf
DOI
10.1109/NEMS.2015.7147476
Filename
7147476
Link To Document