Title :
Creating compact models using standard spreadsheet software
Author :
Noebauer, Gerhard
Author_Institution :
Infineon Technol., Munich, Germany
Abstract :
Methods are proposed for the determination of boundary conditions independent (BCI) compact thermal models. These flexible techniques can be utilized in combination with the input/output capabilities and standard functions of common spreadsheet programs, which are particularly useful in the process of error minimization. First, the steady-state is considered where resistor models are applicable. On a fast time scale, one-dimensional Cauer resistor-capacitor networks are sufficient to model transient behavior. This paper presents a way to obtain analytical solutions for RC ladders of arbitrary size. The method also eases network conversion. The steady-state and short-time behavior is used as basis information for derivation of BCI transient models. A numerical integration technique applicable to any network is outlined. The proposed techniques are used within the process of development of a transient BCI model for Infineon´s BTS840S2 dual chip device, assembled in a P-DSO-20-10 package, which predicts the junction temperatures for any switching state
Keywords :
RC circuits; circuit analysis computing; error analysis; integrated circuit modelling; integrated circuit packaging; integration; minimisation; multichip modules; spreadsheet programs; thermal analysis; thermal management (packaging); transient analysis; 1D Cauer resistor-capacitor networks; BCI compact thermal models; BCI transient models; Infineon BTS840S2 dual chip device; P-DSO-20-10 package assembly; RC ladders; boundary conditions independent compact thermal models; compact models; error minimization; flexible techniques; input/output capabilities; junction temperatures; network conversion; numerical integration technique; resistor models; short-time behavior; spreadsheet programs; standard functions; standard spreadsheet software; steady-state behavior; switching state; transient BCI model; transient behavior model; Boundary conditions; Cost function; Integrated circuit modeling; Packaging; Predictive models; Resistors; Software standards; Steady-state; Temperature distribution; Thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6649-2
DOI :
10.1109/STHERM.2001.915161