• DocumentCode
    3021187
  • Title

    Simulation of wireless passive SAW sensors based on FEM/BEM model

  • Author

    Fu, Qiuyun ; Luo, Wei ; Wang, Yi ; Wang, Jianling ; Zhou, Dongxiang

  • Author_Institution
    Dept. of Electron. Sci. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    1861
  • Lastpage
    1864
  • Abstract
    Research on the wireless passive surface acoustic wave (SAW) impedance-loaded sensors has received significant attention in recent years. This paper concentrates on the simulation method of these sensors. In our previous work, the coupling-of-modes (COM) model of impedance-loaded SAW sensors was constructed based on the models of SAW IDT. The accuracy of this model depends on the accuracy of their parameters. A numerical combined finite element method and boundary element method (FEM/BEM) model was used to derive COM parameters more accurately in this paper. We used a finite element method to account for the mass loading effect of electrodes and use a Green´s function to model the piezoelectric substrate. Comparison between simulations and measurements on real SAW devices shows good agreement and proofs the effectiveness of this simulation method.
  • Keywords
    Green´s function methods; acoustic impedance; boundary-elements methods; distributed sensors; finite element analysis; piezoelectric materials; surface acoustic wave sensors; FEM-BEM model; Green´s function; boundary element method; coupling-of-modes model; finite element method; impedance-loaded SAW sensor; mass loading effect; piezoelectric substrate; wireless passive SAW sensor; Acoustic sensors; Acoustic waves; Boundary element methods; Electrodes; Finite element methods; Green´s function methods; Surface acoustic wave devices; Surface acoustic waves; Surface impedance; Wireless sensor networks; FEM/BEM model; SAW sensor; impedance-loaded sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0458
  • Filename
    4803399