DocumentCode
3021868
Title
Thermal analysis on supersonic ellipsoidal dome
Author
Jiang, Zhenhai ; Wei, Qun ; Jia, Hongguang
Author_Institution
Changchun Inst. of Opt., Fine Mech. & Phys., Changchun, China
fYear
2011
fDate
26-28 July 2011
Firstpage
6143
Lastpage
6146
Abstract
Studied the transient thermal transfer analysis method due to a kind of supersonic ellipsoidal dome, which is a conformal dome. Illuminated the principle of transient thermal transfer analysis. Accomplished the transient thermal analysis based on the model of ellipsoidal dome, and studied the influence about the different material and the different velocity. Considered three materials consist of MgF2, Al2O3, and ZnS, and meanwhile, the velocity was Mach2.5, and the time consists of 10s, 20s and 60s. The temperature initial loads were from FLUENT thermal simulation. The thermal conduction analysis and the thermal convection analysis were finished in software ANSYS, in which the entire transient thermal analysis consists of modeling, meshing element, calculating and getting the results. The different temperature distributions based on varied time were gotten about the different materials. The results from analysis showed the temperature distribution of the structure of ellipsoidal dome, which could help the following coupled thermal-structure analysis.
Keywords
aluminium compounds; convection; heat conduction; magnesium compounds; structural engineering; temperature distribution; thermal analysis; transient analysis; zinc compounds; ANSYS software; Al2O3; FLUENT thermal simulation; Mach2.5; MgF2; ZnS; conformal dome; coupled thermal-structure analysis; meshing element; supersonic ellipsoidal dome; temperature distributions; thermal conduction analysis; thermal convection analysis; time 10 s; time 20 s; time 60 s; transient thermal transfer analysis method; Materials; Missiles; Optics; Temperature distribution; Thermal analysis; Thermal conductivity; Transient analysis; conformal; temperature distribution; transient thermal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Multimedia Technology (ICMT), 2011 International Conference on
Conference_Location
Hangzhou
Print_ISBN
978-1-61284-771-9
Type
conf
DOI
10.1109/ICMT.2011.6001681
Filename
6001681
Link To Document