• DocumentCode
    3021868
  • Title

    Thermal analysis on supersonic ellipsoidal dome

  • Author

    Jiang, Zhenhai ; Wei, Qun ; Jia, Hongguang

  • Author_Institution
    Changchun Inst. of Opt., Fine Mech. & Phys., Changchun, China
  • fYear
    2011
  • fDate
    26-28 July 2011
  • Firstpage
    6143
  • Lastpage
    6146
  • Abstract
    Studied the transient thermal transfer analysis method due to a kind of supersonic ellipsoidal dome, which is a conformal dome. Illuminated the principle of transient thermal transfer analysis. Accomplished the transient thermal analysis based on the model of ellipsoidal dome, and studied the influence about the different material and the different velocity. Considered three materials consist of MgF2, Al2O3, and ZnS, and meanwhile, the velocity was Mach2.5, and the time consists of 10s, 20s and 60s. The temperature initial loads were from FLUENT thermal simulation. The thermal conduction analysis and the thermal convection analysis were finished in software ANSYS, in which the entire transient thermal analysis consists of modeling, meshing element, calculating and getting the results. The different temperature distributions based on varied time were gotten about the different materials. The results from analysis showed the temperature distribution of the structure of ellipsoidal dome, which could help the following coupled thermal-structure analysis.
  • Keywords
    aluminium compounds; convection; heat conduction; magnesium compounds; structural engineering; temperature distribution; thermal analysis; transient analysis; zinc compounds; ANSYS software; Al2O3; FLUENT thermal simulation; Mach2.5; MgF2; ZnS; conformal dome; coupled thermal-structure analysis; meshing element; supersonic ellipsoidal dome; temperature distributions; thermal conduction analysis; thermal convection analysis; time 10 s; time 20 s; time 60 s; transient thermal transfer analysis method; Materials; Missiles; Optics; Temperature distribution; Thermal analysis; Thermal conductivity; Transient analysis; conformal; temperature distribution; transient thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multimedia Technology (ICMT), 2011 International Conference on
  • Conference_Location
    Hangzhou
  • Print_ISBN
    978-1-61284-771-9
  • Type

    conf

  • DOI
    10.1109/ICMT.2011.6001681
  • Filename
    6001681