Nanoindentation creep analysis of gold ball bond

The analysis of indentation creep of gold, Au ball bond was carried out by using nanoindentation approach. 3 × 4 arrays of indentation were indented at three location of Au ball bond namely gold, Au Zone, intermetallic compounds, IMC Zone and Silicon, Si Zone. It was observed that Au and IMC have higher creep behavior compared to that of Si. The responsible indentation creep mechanism for Au and IMC of ball bond that have been subjected 1000 hours of HTS was the dislocation glide. It was noted that the lower plastic deformation or creep effect of IMC was due to the higher hardness value which demonstrated the strain hardening effect compared to that of Au.