• DocumentCode
    3027832
  • Title

    Low-temperature epitaxial thickening of sub-micron poly-Si seeding layers on glass made by aluminium-induced crystallisation

  • Author

    Harder, N.-P. ; Xia, J.A. ; Oelting, S. ; Nast, O. ; Widenborg, P. ; Aberle, A.G.

  • Author_Institution
    Photovoltaics Special Res. Centre, New South Wales Univ., Sydney, NSW, Australia
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    351
  • Lastpage
    354
  • Abstract
    The formation of device-grade polycrystalline silicon (poly-Si) films on standard glass at low temperature (i.e., below the softening point of the glass) using simple and fast processes is one of the major challenges for low-cost thin-film solar cells. In this paper, we report what is believed to be the first successful realisation of thick (~5 μm), large-grained (~5 μm), continuous poly-Si films on glass at T<650°C. This technological breakthrough has been achieved by using ion-assisted deposition at 630°C for epitaxially thickening a thin (~0.4 μm) seeding layer made on glass by aluminium-induced crystallisation
  • Keywords
    aluminium; crystallisation; elemental semiconductors; glass; ion beam assisted deposition; semiconductor epitaxial layers; semiconductor thin films; silicon; solar cells; substrates; 0.4 mum; 5 mum; 630 C; Al; Si; aluminium-induced crystallisation; device-grade polycrystalline silicon; glass; ion-assisted deposition; large-grained continuous poly-Si films; low-cost thin-film solar cells; low-temperature epitaxial thickening; poly-Si films; softening point; sub-micron poly-Si seeding layers; thin seeding layer; Aluminum; Crystallization; Glass; Photovoltaic cells; Semiconductor films; Semiconductor thin films; Silicon; Softening; Temperature; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
  • Conference_Location
    Anchorage, AK
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-5772-8
  • Type

    conf

  • DOI
    10.1109/PVSC.2000.915836
  • Filename
    915836