DocumentCode
3028375
Title
CIGSS solar cells based on CVD ZnO buffer layers
Author
Olsen, Larry C. ; Addis, F.W. ; Huang, Liang ; Shafaman, W.N. ; Eschbach, Peter ; Exarhos, G.J.
Author_Institution
Washington State Univ., Richland, WA, USA
fYear
2000
fDate
2000
Firstpage
458
Lastpage
461
Abstract
This paper describes investigations of cells based on Siemens Solar material, CIGSS, and highly resistive ZnO (i-ZnO) buffer layers grown by MOCVD. Resistive i-ZnO buffer layers are grown on CIGSS at 100°C, after heating the substrate to 250°C and using nitrogen as a carrier gas. The use of a KCN etch on the CIGSS surface prior to growth of i-ZnO buffer layers was determined to be beneficial to cell performance. XPS studies show that the etching step removes oxygen from the substrate surface that had complexed with Se to form SeO2. Cells that do not receive a KCN etch typically have shunted I-V curves leading to relatively low open circuit voltages, fill factors and efficiencies. A tentative model is proposed for the effect of KCN. Finally, one cell (using a KCN etch) exhibited a total area efficiency of 12.7 % with an open circuit voltage of 0.577 Volts
Keywords
MOCVD coatings; copper compounds; etching; gallium compounds; indium compounds; semiconductor thin films; solar cells; substrates; ternary semiconductors; zinc compounds; 0.577 V; 100 C; 12.7 percent; 250 C; CIGSS solar cells; CVD ZnO buffer layers; Cu(InGa)(SSe)2; KCN etch; MOCVD; SeO2; Siemens Solar material; ZnO; etching step; highly resistive ZnO; i-ZnO buffer layers; low efficiencies; low fill factors; low open circuit voltages; nitrogen carrier gas; open circuit voltage; shunted I-V curves; substrate surface; total area efficiency; Buffer layers; Circuits; Energy conversion; Etching; Hydrogen; MOCVD; Nitrogen; Photovoltaic cells; Substrates; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
Conference_Location
Anchorage, AK
ISSN
0160-8371
Print_ISBN
0-7803-5772-8
Type
conf
DOI
10.1109/PVSC.2000.915869
Filename
915869
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