Abstract :
The following topics are dealt with: I/O circuits; ESD protection; transistors; SoC; reliability; plasma induced damage; 3D integration; CAD; and soft error rate.
Keywords :
CAD; electronic engineering computing; electrostatic discharge; integrated circuit reliability; system-on-chip; three-dimensional integrated circuits; transistors; 3D integration; CAD; ESD protection; I/O circuits; SoC; plasma induced damage; reliability; soft error rate; transistors;
Conference_Titel :
IC Design and Technology (ICICDT), 2010 IEEE International Conference on
Conference_Location :
Grenoble
Print_ISBN :
978-1-4244-5773-1
DOI :
10.1109/ICICDT.2010.5510300