Title :
Interconnect analysis: from 3D structures to circuit models
Author :
Kamon, M. ; Marques, N. ; Massoud, Y. ; Silveira, L. ; White, J.
Author_Institution :
Res. Lab. of Electron., MIT, Cambridge, MA, USA
Abstract :
In this survey paper we describe the combination of: discretized integral formulations, sparsification techniques, and Krylov-subspace based model-order reduction that has led to robust tools for automatic generation of macromodels that represent the distributed RLC effects in 3D interconnect. A few computational results are presented, mostly to point out the problems yet to be addressed
Keywords :
distributed parameter networks; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; sparse matrices; 3D structures; Krylov-subspace based model-order reduction; automatic generation; circuit models; computational results; discretized integral formulations; distributed RLC effects; interconnect analysis; macromodels; sparsification techniques; Conductors; Current density; Inductance; Integral equations; Integrated circuit interconnections; Laboratories; Paper technology; Permission; RLC circuits; Robustness;
Conference_Titel :
Design Automation Conference, 1999. Proceedings. 36th
Conference_Location :
New Orleans, LA
Print_ISBN :
1-58113-092-9
DOI :
10.1109/DAC.1999.782221
