DocumentCode :
3034917
Title :
Hardening techniques for MRAM-based non-volatile storage cells and logic
Author :
Lakys, Y. ; Zhao, W.S. ; Klein, J.-O. ; Chappert, C.
Author_Institution :
IEF, Univ. Paris-Sud, Orsay, France
fYear :
2011
fDate :
19-23 Sept. 2011
Firstpage :
669
Lastpage :
674
Abstract :
Magnetic RAM (MRAM) is considered as a promising non-volatile memory technology for aerospace and avionic electronics thanks to its intrinsic hardness to radiation. Data is stored on the spin direction “up” and “down” of electrons instead of positive and negative charge. However, MRAM-based non-volatile storage cells and logic circuits are vulnerable to Single Event Effects (SEE) due to their CMOS peripheral circuits. Hardening techniques to mitigate SEE are presented in this paper. A new design of Radhard MRAM latch is firstly presented. TMR technique is then implemented on Configurable Logic Block to mitigate SET on data paths. By using 65 nm design kit and an MRAM compact model, hybrid simulations have been done to demonstrate the radiation hardness.
Keywords :
CMOS logic circuits; CMOS memory circuits; MRAM devices; flip-flops; magnetic logic; radiation hardening (electronics); CMOS peripheral circuits; MRAM compact model; Radhard MRAM latch; TMR technique; aerospace electronics; avionic electronics; configurable logic block; magnetic RAM; magnetic logic circuit; negative charge; nonvolatile memory technology; nonvolatile storage cells; positive charge; radiation hardness techniques; single event effects; size 65 nm; Latches; Magnetic tunneling; Nonvolatile memory; Sensors; Single event upset; Transistors; Tunneling magnetoresistance; MRAM; Multi-context; Non-Volatile; Radiation Hardness by Design; SEU; Spintronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radiation and Its Effects on Components and Systems (RADECS), 2011 12th European Conference on
Conference_Location :
Sevilla
ISSN :
0379-6566
Print_ISBN :
978-1-4577-0585-4
Type :
conf
DOI :
10.1109/RADECS.2011.6131445
Filename :
6131445
Link To Document :
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