Title :
High viscose ink jetting by using nScrypt Head and application
Author :
Oh, DongHoon ; Kim, NamSoo
Author_Institution :
KEN Res. Center, Seokyoung Univ., Seoul, South Korea
Abstract :
For small and flexible electronics appliances, viscosity of nano ink is one of the crucial factors in practical applicating. Monodispersed nano sized particles were used to make conductive pattern without leading clogging when ink jetting process. However, in order to achieve commercially functional devices, the ink jetting and post heat-treating needed to be repeated to obtain minimum conductivity for devices for the successful application the direct writable inks need high conductivity and high packing density for one-touch patterning. In this study, the direct writing mechanism; sequential method and randomized method are defined and in which thick layer with high viscous materials using one touch patterning process were introduced. Random and sequential packing concept has been successfully proved to the nano size particle patterning in various direct write tools such as ink jet, aerosol and micro dispensing. The ideal liquid structure used spherical random packing simulation can predict the packing density of direct writing patterns using ink-jet process and micro dispensing process for high viscous ink.
Keywords :
aerosols; heat conduction; heat treatment; ink jet printing; nanoparticles; aerosol; conductive pattern; conductivity; direct writable inks; direct writing mechanism; electronics appliances; heat-treatment; high viscose ink jetting; ink jetting process; micro dispensing; monodispersed nano sized particles; nScrypt Head; nano ink viscosity; nanosize particle patterning; Ink;
Conference_Titel :
Assembly and Manufacturing, 2009. ISAM 2009. IEEE International Symposium on
Conference_Location :
Suwon
Print_ISBN :
978-1-4244-4627-8
Electronic_ISBN :
978-1-4244-4628-5
DOI :
10.1109/ISAM.2009.5376939