Tensile test of single crystal silicon film at elevated temperatures

A tensile-testing system that allows tests at elevated temperature was developed. Using this system, we evaluated the mechanical properties of micro-scale single-crystal silicon film at 573 K. The silicon test specimens had a surface orientation of (100), and a tensile direction of <110>, The average measured Young´s modulus and fracture stress were 144 GPa and 5.19 GPa, respectively, at 573 K. At room temperature, Young´s modulus and fracture stress were 137 GPa and 4.89 GPa. These similar values show that the mechanical properties of single-crystal silicon film hardly change at 573 K compared to room temperature.