A 3D interconnect system for large biosensor array and CMOS signal-processing IC integration

Author

Yang, Hyung Suk ; Ravindran, Ramasamy ; Bakir, Muhannad S. ; Meindl, James D.

Author_Institution

Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2010

fDate

6-9 June 2010

Firstpage

1

Lastpage

3

Abstract

In this paper, two new interconnect technologies designed for integration of a large biosensor array and a signal processing CMOS IC are presented; a TSV technology that can be fabricated in wafers that cannot be aggressively thinned down or have sensitive sensors fabricated in prior processes, and a compliant interconnect technology that enables minimal stress permanent interconnections or low-force temporary interconnections to allow reuse of CMOS ICs. In addition, integration of TSV to a silicon nanowire label-free biosensor is demonstrated.

Keywords

CMOS integrated circuits; biosensors; integrated circuit interconnections; nanowires; signal processing; 3D interconnect system; CMOS signal-processing IC integration; TSV technology; biosensor array; interconnect technology; low-force temporary interconnections; sensitive sensors; signal processing CMOS IC; silicon nanowire label-free biosensor; stress permanent interconnections; Array signal processing; Biomedical signal processing; Biosensors; CMOS integrated circuits; CMOS process; CMOS technology; Sensor arrays; Signal design; Stress; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference (IITC), 2010 International

Conference_Location

Burlingame, CA

Print_ISBN

978-1-4244-7676-3

Type

conf

DOI

10.1109/IITC.2010.5510591

Filename

5510591