Title :
ISTFA best paper: FemtoFarad/TeraOhm endpoint detection for microsurgery of integrated circuit devices
Author_Institution :
FA Instrum., Inc., San Jose, CA, USA
Abstract :
Interactive electrical endpoint detection when thinning conductive and capacitive materials opens the door to approaching a suspect site in an IC without relying on the traditional iterative approach. Controlled approach of embedded conductors in insulators (packages) as well as controlled die thinning with submicron control will be shown, allowing safe approach to the desired feature without overshoot.
Keywords :
capacitors; conductors (electric); insulators; integrated circuit packaging; IC; ISTFA; capacitive material thinning; conductive material thinning; controlled die thinning; embedded conductor; femtofarad-teraohm endpoint detection; insulator; integrated circuit device; interactive electrical endpoint detection; iterative approach; microsurgery; packaging; submicron control; Capacitance; Cavity resonators; Integrated circuits; Milling; Plastics; Wires;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599192
