Title :
AT&T lead-free solder paste for the cost effective manufacture of flip-chip silicon-on-silicon MCM
Author :
Degani, Y. ; Dudderar, T.D.
Author_Institution :
Mater. & Technol. Integration Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
The development and implementation of a lead-free solder based Multichip Module (MCM) tile assembly technology called AT&T micro-Surface Mount Technology or AT&T μSMT is described. This novel technology exploits a unique Sn/Sb solder paste, batch processing and high speed automated flip-chip assembly to achieve high through-put and yield. As a result it is now possible to manufacture highly integrated MCM products in the numbers required to assure a competitive cost by permitting the distribution of capital expenses over a large production volume, and to do so without compromising their inherent advantages in performance and (small) size
Keywords :
batch processing (industrial); circuit optimisation; economics; flip-chip devices; integrated circuit manufacture; integrated circuit yield; microassembling; multichip modules; printed circuit manufacture; soldering; AT&T; MCM based PWB manufacture; MCM packaging; Si; Sn/Sb solder paste; SnSb; batch processing; cost effective manufacture; flip-chip MCM tiles; flip-chip Si-on-Si MCM; high speed automated flip-chip assembly; high throughput; high yield; lead-free solder paste; micro-Surface Mount Technology; next level interconnect; Assembly; Costs; Environmentally friendly manufacturing techniques; Fabrics; Integrated circuit interconnections; Lead; Manufacturing automation; Production; Silicon; Tiles;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404696
