DocumentCode :
3039636
Title :
The worst stress condition of hot carrier degradation on high voltage LDMOSFET
Author :
Huayang, Sarah Zhou ; Yongliang Song ; Zhuo Song ; Yanju, Lisa Yu ; Yong, Atman Zhao ; Wu, Junyong ; Chang, V. ; Chien, Kary
Author_Institution :
Semicond. Manuf. Int. Corp., Shanghai, China
fYear :
2013
fDate :
15-19 July 2013
Firstpage :
694
Lastpage :
696
Abstract :
This paper reports the research of applying the worst stress condition of thick gate oxide LDMOSFET hot carrier reliability. Based on electrical characteristic and hot carrier degradation investigation, the worst stress condition selection and failure mechanism are discussed and then the reasonable stress condition is proposed in this paper.
Keywords :
MOSFET; failure analysis; hot carriers; semiconductor device reliability; stress effects; electrical characteristic; failure mechanism; high voltage LDMOSFET; hot carrier degradation; hot carrier reliability; thick gate oxide LDMOSFET; worst stress condition selection; Degradation; Hot carriers; Human computer interaction; Logic gates; Stress; Substrates; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
ISSN :
1946-1542
Print_ISBN :
978-1-4799-1241-4
Type :
conf
DOI :
10.1109/IPFA.2013.6599255
Filename :
6599255
Link To Document :
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