Title :
Rubber stamped plastic circuits for electronic paper
Author :
Rogers, John A. ; Baldwin, Kirk ; Bao, Zhenan ; Dodabalapur, Ananth ; Raju, V.R. ; Ewing, Jay ; Amundson, Karl
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (~1 μm) of the printed elements, the large area coverage (~1 sq ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics
Keywords :
display devices; electrophoresis; integrated circuit technology; molecular electronics; organic semiconductors; area coverage; electrical performance; electronic paper; high resolution rubber stamping; microcontact printing; microencapsulated electrophoretic inks; organic semiconductors; pattern resolution; patterning; plastic active matrix drive circuitry; plastic electronics; printed element resolution; processing sequences; rubber stamped plastic circuits; Active matrix technology; Backplanes; Circuits; Displays; Electrodes; Ink; Plastics; Rubber; Switches; Transistors;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916556
