DocumentCode :
3040343
Title :
"Dry-to-the-touch" thermal grease
Author :
Khatri, Prakash ; Ziemski, John
Author_Institution :
AOS Thermal Compounds, Eatontown, NJ, USA
fYear :
2001
fDate :
14-14 March 2001
Firstpage :
236
Lastpage :
239
Abstract :
Most thermal engineers believe that thermal greases (or heat sink compounds) provide the lowest thermal resistance of all thermal interface materials. Micro-faze/sup (R)/ is a proprietary design, dry-to-the-touch thermal grease product that offers the lowest thermal resistance at low closure force, thus eliminating the need to sacrifice thermal performance for convenience. This dry grease is totally adaptable to die-cut and possesses a natural tackiness that allows it to adhere to a component or heat sink without using adhesives that degrade thermal performance. The material also exhibits a positive CTE and its thixotropic properties allow it to wet surfaces, further improving interface contact. It is electrically insulating in one version. It is silicone-free in both versions so that contamination problems are avoided. With thermal management becoming ever more complex, engineers must measure the convenience of silicone elastomer thermal pads and more recent wax-based phase-change materials against the superior performance demonstrated by thermal grease. Although easy to use, thermal pads still show a relatively high thermal resistance; phase-change materials may perform better, yet bear limitations in performance. While grease offers superior performance, it can be messy and difficult to handle, thereby becoming labor intensive, making these considerations key factors in the rationale for product development. This paper describes a new thermal interface material that uses all of the advantages of grease replacements, with the lowest thermal resistance of actual thermal grease.
Keywords :
adhesion; assembling; heat sinks; materials handling; thermal expansion; thermal management (packaging); thermal resistance; thixotropy; wetting; Micro-faze thermal grease; closure force; component adhesion; contamination; die-cut adaptability; dry grease; dry-to-the-touch thermal grease; electrically insulating grease; grease handling; grease replacements; heat sink adhesion; heat sink compounds; interface contact; labor intensive process; natural tackiness; phase-change materials; positive CTE; product development; proprietary design; silicone elastomer thermal pads; silicone-free grease; surface wetting; thermal grease; thermal interface material; thermal interface materials; thermal management; thermal pads; thermal performance; thermal resistance; thixotropic properties; wax-based phase-change materials; Contacts; Heat engines; Heat sinks; Resistance heating; Surface contamination; Thermal degradation; Thermal engineering; Thermal force; Thermal management; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA, USA
Print_ISBN :
0-930815-64-5
Type :
conf
DOI :
10.1109/ISAOM.2001.916581
Filename :
916581
Link To Document :
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