DocumentCode :
304269
Title :
Characteristics of semiconductor devices at cryogenic temperatures
Author :
Jackson, William D. ; Mazzoni, Omar S. ; Schempp, Ellery
Author_Institution :
HMJ Corp., Kensington, MD, USA
Volume :
2
fYear :
1996
fDate :
11-16 Aug 1996
Firstpage :
676
Abstract :
Overall system requirements have been identified in which it is at least potentially advantageous to operate power conditioning subsystems in a cryogenic environment below about 150 K, 77 K being particularly favored because of liquid nitrogen. As the prospects for adapting passive components to these temperatures are encouraging, the critical issue is the availability of a controlled switch which operates at least as well as at normal ambient conditions. This paper reports the results of a study to determine and compare the characteristics of available semiconductor devices. It establishes majority carrier field effect devices (MOSFETs) as the leading contender and the need to design and develop devices specifically for cryogenic temperatures to obtain optimum performance
Keywords :
cryogenic electronics; field effect transistor switches; power MOSFET; power field effect transistors; power semiconductor switches; semiconductor device testing; 77 K; MOSFETs; controlled switch; cryogenic temperatures; majority carrier field effect devices; optimum performance; passive components; power conditioning subsystems; semiconductor device characteristics; Communication switching; Cryogenics; FETs; Insulated gate bipolar transistors; MOSFETs; Power conditioning; Power semiconductor switches; Semiconductor devices; Temperature; Thyristors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location :
Washington, DC
ISSN :
1089-3547
Print_ISBN :
0-7803-3547-3
Type :
conf
DOI :
10.1109/IECEC.1996.553779
Filename :
553779
Link To Document :
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