• DocumentCode
    304376
  • Title

    Simulation and analysis of high-frequency low-profile inductors

  • Author

    Hu, Y.Q. ; Cheng, K.W. ; He, D.H. ; Mo, W.K.

  • Author_Institution
    Nat. Synchrotron Radiat. Lab., Univ. of Sci. & Technol. of China, Hefei, China
  • Volume
    3
  • fYear
    1996
  • fDate
    6-10 Oct 1996
  • Firstpage
    1377
  • Abstract
    The relationship between the power loss, winding and core geometries of the high-frequency low-profile (HFLP) inductor is investigated with the aid of finite element method. The simulation results have shown that a magnetic core with lumped air gaps can cause excessive loss in the windings, and the core loss depends on the air gap size and the high frequency characteristics of the magnetic material. The geometry of the winding is a significant factor to determine the total AC loss. The optimal thickness of the inductor winding is determined by the length and distribution of air gaps. The multi-layer winding arrangement is believed to be the most promising solution to reduce the power loss and leakage field. The finite element analysis also indicates that the total loss in the inductor with square-wave current excitation is over double that with sinusoidal excitation. Practical design rules are given along with the simulations
  • Keywords
    design engineering; finite element analysis; inductors; magnetic cores; magnetic leakage; windings; design rules; finite element method; high-frequency low-profile inductors; leakage field; lumped air gaps; magnetic core geometries; magnetic material; multi-layer winding arrangement; power loss; simulation results; sinusoidal excitation; square-wave current excitation; winding geometries; Air gaps; Analytical models; Core loss; Finite element methods; Frequency; Geometry; Inductors; Magnetic analysis; Magnetic cores; Magnetic materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-3544-9
  • Type

    conf

  • DOI
    10.1109/IAS.1996.559245
  • Filename
    559245