DocumentCode
3044783
Title
Giant Piezoresistance of Nano-Thick Silicon Induced by Interface Electron Traping Effect
Author
Yang, Yongliang ; Li, Xinxin
Author_Institution
Shanghai Inst. of Microsyst. & Inf. Technol., Chinese Acad. of Sci., Shanghai, China
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
555
Lastpage
558
Abstract
Both n- and p-type nano-thick piezoresistors are fabricated on SOI (silicon on insulator) wafers using micro-fabrication processes. Giant piezoresistance is measured and theoretically explained for nano-thick silicon resistors. Compared to bulk silicon, one order of magnitude higher piezoresistive coefficients are, for the first time, tested with 13 nm-thick n-type and 9 nm p-type samples. Surpassing 2-D quantum effect, Si-SiO2 interface electron trapping effect dominates the giant piezoresistance. Different from equivalent mobility change in conventional piezoresistance of bulk silicon, the giant piezoresistance come from carrier concentration change and have the same effect on the longitudinal and transverse piezoresistors.
Keywords
microfabrication; nanotechnology; piezoresistive devices; resistors; silicon compounds; silicon-on-insulator; SOI wafers; Si-SiO2; giant piezoresistance; interface electron traping effect; micro-fabrication processes; n-type nano-thick piezoresistors; nano-thick silicon resistors; p-type nano-thick piezoresistors; silicon on insulator wafers; size 13 nm; size 9 nm; Electron traps; Fabrication; Mechanical sensors; Piezoresistance; Piezoresistive devices; Potential well; Resistors; Silicon on insulator technology; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805442
Filename
4805442
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