• DocumentCode
    3045388
  • Title

    Novel Technology for Capacitive Pressure Sensors with Monocrystalline Silicon Membranes

  • Author

    Knese, K. ; Armbruster, S. ; Weber, H. ; Fischer, M. ; Benzel, H. ; Metz, M. ; Seidel, H.

  • Author_Institution
    Eng.-Sensor Technol. Center, Robert Bosch GmbH, Reutlingen
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    697
  • Lastpage
    700
  • Abstract
    We report on a novel surface micromachining technology for the fabrication of capacitive absolute pressure sensors. The pressure sensitive membrane is formed by single crystal silicon enabling excellent long term stability. The membrane formation is based on the Advanced Porous Silicon Membrane (APSM) process [1], which is currently applied to piezoresistive transducers. Expanding this technology to capacitive transduction allows for a greater flexibility in tailoring the sensor properties to specific applications [2]. This expansion is implemented by adding a poly-Si counter electrode layer on top of the membrane in a surface micromachining step. Since only front side processing on standard silicon substrates is used, this method is very cost-efficient and fully CMOS-compatible, enabling monolithic integration of circuitry.
  • Keywords
    CMOS integrated circuits; capacitive sensors; electrochemical electrodes; elemental semiconductors; micromachining; microsensors; piezoresistive devices; porous semiconductors; pressure sensors; silicon; APSM process; CMOS; Si; advanced porous silicon membrane; capacitive pressure sensor fabrication; capacitive transduction; monocrystalline silicon membrane; monolithic integration; piezoresistive transducer; polysilicon counter electrode layer; standard silicon substrate; surface micromachining technology; Biomembranes; Capacitive sensors; Counting circuits; Electrodes; Fabrication; Micromachining; Piezoresistance; Silicon; Stability; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805478
  • Filename
    4805478