DocumentCode
3045388
Title
Novel Technology for Capacitive Pressure Sensors with Monocrystalline Silicon Membranes
Author
Knese, K. ; Armbruster, S. ; Weber, H. ; Fischer, M. ; Benzel, H. ; Metz, M. ; Seidel, H.
Author_Institution
Eng.-Sensor Technol. Center, Robert Bosch GmbH, Reutlingen
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
697
Lastpage
700
Abstract
We report on a novel surface micromachining technology for the fabrication of capacitive absolute pressure sensors. The pressure sensitive membrane is formed by single crystal silicon enabling excellent long term stability. The membrane formation is based on the Advanced Porous Silicon Membrane (APSM) process [1], which is currently applied to piezoresistive transducers. Expanding this technology to capacitive transduction allows for a greater flexibility in tailoring the sensor properties to specific applications [2]. This expansion is implemented by adding a poly-Si counter electrode layer on top of the membrane in a surface micromachining step. Since only front side processing on standard silicon substrates is used, this method is very cost-efficient and fully CMOS-compatible, enabling monolithic integration of circuitry.
Keywords
CMOS integrated circuits; capacitive sensors; electrochemical electrodes; elemental semiconductors; micromachining; microsensors; piezoresistive devices; porous semiconductors; pressure sensors; silicon; APSM process; CMOS; Si; advanced porous silicon membrane; capacitive pressure sensor fabrication; capacitive transduction; monocrystalline silicon membrane; monolithic integration; piezoresistive transducer; polysilicon counter electrode layer; standard silicon substrate; surface micromachining technology; Biomembranes; Capacitive sensors; Counting circuits; Electrodes; Fabrication; Micromachining; Piezoresistance; Silicon; Stability; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805478
Filename
4805478
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