• DocumentCode
    3045441
  • Title

    Silicon Carbide Surface Micromachining Technology by Tetramethylsilane-Based Atmospheric Vapor Deposition

  • Author

    Hatakeyama, Y. ; Esashi, M. ; Tanaka, S.

  • Author_Institution
    Grad. Sch. of Eng., Tohoku Univ., Tohoku
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    709
  • Lastpage
    712
  • Abstract
    Systematic study on selective silicon carbide (SiC) deposition on SiN, SiO2 and Si was performed. Poly-SiC was deposited by atmospheric pressure vapor deposition (APCVD) using tetramethylsilane (TMS), which allows easy handling and low temperature deposition. We found a process condition enabling the selective SiC deposition as well as a design guideline for SiC surface micromachining based on the selective SiC deposition. If both process condition and design guideline are used, continuous fine-grained SiC films are deposited on SiN and Si, while SiC islands are deposited on SiO2. SiC films on SiN are used as the microstructures, and SiC islands on SiO2 are lifted off by SiO2 sacrificial etching. Finally, movable SiC microstructures were fabricated by the developed surface micromachining technology.
  • Keywords
    micromachining; silicon compounds; vapour deposition; SiC; SiN; SiO2; atmospheric pressure vapor deposition; atmospheric vapor deposition; surface micromachining technology; Chemical vapor deposition; Etching; Guidelines; Micromachining; Microstructure; Process design; Semiconductor films; Silicon carbide; Silicon compounds; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805481
  • Filename
    4805481