DocumentCode
3045441
Title
Silicon Carbide Surface Micromachining Technology by Tetramethylsilane-Based Atmospheric Vapor Deposition
Author
Hatakeyama, Y. ; Esashi, M. ; Tanaka, S.
Author_Institution
Grad. Sch. of Eng., Tohoku Univ., Tohoku
fYear
2009
fDate
25-29 Jan. 2009
Firstpage
709
Lastpage
712
Abstract
Systematic study on selective silicon carbide (SiC) deposition on SiN, SiO2 and Si was performed. Poly-SiC was deposited by atmospheric pressure vapor deposition (APCVD) using tetramethylsilane (TMS), which allows easy handling and low temperature deposition. We found a process condition enabling the selective SiC deposition as well as a design guideline for SiC surface micromachining based on the selective SiC deposition. If both process condition and design guideline are used, continuous fine-grained SiC films are deposited on SiN and Si, while SiC islands are deposited on SiO2. SiC films on SiN are used as the microstructures, and SiC islands on SiO2 are lifted off by SiO2 sacrificial etching. Finally, movable SiC microstructures were fabricated by the developed surface micromachining technology.
Keywords
micromachining; silicon compounds; vapour deposition; SiC; SiN; SiO2; atmospheric pressure vapor deposition; atmospheric vapor deposition; surface micromachining technology; Chemical vapor deposition; Etching; Guidelines; Micromachining; Microstructure; Process design; Semiconductor films; Silicon carbide; Silicon compounds; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location
Sorrento
ISSN
1084-6999
Print_ISBN
978-1-4244-2977-6
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2009.4805481
Filename
4805481
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