DocumentCode :
3046449
Title :
Thermal Analysis and Characterization of a High Q Film Bulk Acoustic Resonator (FBAR) as Biosensers in Liquids
Author :
Zhang, Xu ; Xu, Wencheng ; Abbaspour-Tamijani, Abbas ; Chae, Junseok
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ
fYear :
2009
fDate :
25-29 Jan. 2009
Firstpage :
939
Lastpage :
942
Abstract :
This paper presents the thermal analysis and characterization of a zinc oxide (ZnO) based film bulk acoustic resonator (FBAR) having a high quality factor (Q) in liquid environments for biosensing applications. Q of up to 120, an improvement of at least 8times greater than state-of-the-art devices in liquids, are achieved by integrating microfluidic channels with heights comparable to the acoustic wavelength in FBAR. In order to achieve temperature stability in the highly sensitive FBAR sensor, we analyze sources of thermal effects and characterize FBAR in a Pierce oscillator. Measurements show a temperature coefficient of oscillation frequency (TCF) of -112 ppm/K for the uncompensated circuit. We show that this thermal drift can be reduced to less than 1 ppm/K by applying a properly chosen bias to the oscillator, which suggests the possibility of a feedback approach to achieve thermal stability.
Keywords :
Q-factor; acoustic resonators; bioMEMS; biosensors; bulk acoustic wave devices; microfluidics; microsensors; thermal stability; thin film sensors; zinc compounds; FBAR acoustic wavelength; FBAR sensor temperature stability; Pierce oscillator; ZnO; film bulk acoustic resonator; high Q FBAR biosensor characterization; high Q FBAR biosensor thermal analysis; liquid environment biosensing applications; microfluidic channels; temperature oscillation frequency coefficient; thermal effects; zinc oxide based FBAR; Biosensors; Circuit stability; Film bulk acoustic resonators; Liquids; Oscillators; Temperature measurement; Temperature sensors; Thermal factors; Thermal stability; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
ISSN :
1084-6999
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2009.4805539
Filename :
4805539
Link To Document :
بازگشت