DocumentCode :
3048638
Title :
Etching Processes of Carbon Nanowalls Using Dual-frequency Parallel-plate Capacitively Coupled Plasma
Author :
Kondo, Shingo ; Noda, Akio ; Yamakawa, Koji ; Den, Shoji ; Hiramatsu, Mineo ; Hori, Masaru
Author_Institution :
Nagoya Univ., Nagoya
fYear :
2007
fDate :
5-8 Nov. 2007
Firstpage :
162
Lastpage :
163
Abstract :
Carbon nanowalls (CNWs) is synthesized using the radical injection plasma enhanced chemical vapor deposition (CVD) system. In the initial growth process of CNWs on a Si substrate fabricated by the system, the carbon thin film of approximately 10 nm in thickness is deposited for 1 minute before CNWs grow in the vertical direction. The thin film is etched by using dual-frequency parallel-plate capacitively coupled plasma. SEM images characterise the CNWs. The etching rates of the CNWs and the carbon thin film are 150 nm/min and 15 nm/min, respectively. In order to extend applications of CNWs, the carbon thin film is removed from CNWs.
Keywords :
carbon; nanostructured materials; nanotechnology; plasma CVD; scanning electron microscopy; sputter etching; thin films; C; CVD; SEM; carbon nanowalls; carbon thin film; dual-frequency parallel-plate capacitively coupled plasma; etching; plasma enhanced chemical vapor deposition; size 10 nm; Argon; Chemical vapor deposition; Etching; Hydrogen; Material storage; Nanoscale devices; Plasma applications; Semiconductor thin films; Substrates; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
Type :
conf
DOI :
10.1109/IMNC.2007.4456154
Filename :
4456154
Link To Document :
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