Title :
Imprinting of polyimide without residual layers
Author :
Pai, I-Ting ; Leu, Ing-Chi ; Hon, Min Hsiung
Author_Institution :
Nat. Cheng Kung Univ., Tainan
Abstract :
In this study, imprinting condition of 180degC for 20 minutes is used to fabricate patterned polyimide (PI) films. Results provides a simple approach to fabricate patterns without residual layer due to the dewetting behavior between the poly-amic acid (PAA) solution and imprint stamp.
Keywords :
moulding; polymer films; dewetting; polyamic acid solution; polyimide films; polyimide imprinting; temperature 180 degC; time 20 min; Cleaning; Copper; Curing; Materials science and technology; Polyimides; Scanning electron microscopy; Solvents; Temperature;
Conference_Titel :
Microprocesses and Nanotechnology, 2007 Digest of papers
Conference_Location :
Kyoto
Print_ISBN :
978-4-9902472-4-9
DOI :
10.1109/IMNC.2007.4456221
