• DocumentCode
    3050397
  • Title

    Novel investigation for specimens aging tests under partial discharges and temperature

  • Author

    Vibhakar, C.K. ; Kanitkar, S.A.

  • Author_Institution
    M.S. Univ., Vadodara, India
  • fYear
    2009
  • fDate
    18-21 Oct. 2009
  • Firstpage
    433
  • Lastpage
    436
  • Abstract
    This paper is based on the investigations made by applying H.V. test on four different specimens under different combinations of voltage and temperature considering effect on partial discharge (PD). According to the IS: 11322-1985 manual and IOP publication 35 {IOP report publication 35(2002) 33-39} the effects of an investigation of interaction between PD and temperature on epoxy resin has been studied. These are simple electrode system with a pin hole (cavity) in epoxy resin widely employed in high-voltage insulation apparatus. Each specimen is passed from x-ray unit to check the size of pin hole and placed at high voltage assembly. The specimen temperature regulation from -20°C to 120°C is performed by thermal chamber at work place. On the basis of a previously performed analysis of the ageing mechanism taking place in different materials, simple phenomenological aging and life effects are proposed in this work. It gives a new approach to the problem that appears to be a useful tool for future application on electrical components. Also investigation relation between the temperature and PD was modeled considering stress function as per inverse power law.
  • Keywords
    ageing; epoxy insulators; partial discharge measurement; resins; aging test; epoxy resin; partial discharges; Aging; Assembly; Electrodes; Epoxy resins; Insulation; Partial discharges; Performance analysis; Temperature; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
  • Conference_Location
    Virginia Beach, VA
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4244-4557-8
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2009.5377733
  • Filename
    5377733