• DocumentCode
    3051350
  • Title

    DC conduction current, dielectric strength and electroluminescence of standard, nanofilled and microfilled polyetherimide varnishes

  • Author

    Mary, D. ; Malee, D. ; Nguyen, M.Q. ; Werynski, P. ; Gornicka, B. ; Therese, L. ; Guillot, P.

  • Author_Institution
    Laplace Lab., UPS, Toulouse, France
  • fYear
    2009
  • fDate
    18-21 Oct. 2009
  • Firstpage
    678
  • Lastpage
    681
  • Abstract
    Results of DC conduction, breakdown strength and electroluminescence of standard (PEI), nanoscale-filled and microscale-filled varnishes are described and analyzed in this communication. Silica (10 nm and 400 nm) has been used as a filler to increase the lifetime of such varnishes submitted to a partial discharge activity (varnish to be used in rotating machines fed by inverters). Experimental results have shown that the dielectric properties of the nanofilled varnish, which exhibits the higher PD lifetime under a PD stress, are not highly affected by the fillers. On the contrary, the microfilled varnish properties are strongly modified.
  • Keywords
    composite insulating materials; electric breakdown; electrical conductivity; electroluminescence; filled polymers; insulating coatings; nanocomposites; nanoparticles; organic insulating materials; partial discharges; polymer films; silicon compounds; varnish; DC conduction current; breakdown strength; dielectric properties; dielectric strength; electroluminescence; filler; microscale-filled varnishes; nanoscale-filled varnishes; partial discharge activity; polyetherimide; Breakdown voltage; Dielectric breakdown; Dielectric measurements; Dielectrics and electrical insulation; Electroluminescence; Partial discharges; Particle measurements; Resins; Silicon compounds; Variable speed drives;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
  • Conference_Location
    Virginia Beach, VA
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4244-4557-8
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2009.5377779
  • Filename
    5377779