Title :
Dielectric properties of polypropylene loaded with synthetic organoclay
Author :
Bulinski, A. ; Bamji, S.S. ; Abou-Dakka, M. ; Chen, Y.
Author_Institution :
Inst. for Nat. Meas. Stand., Nat. Res. Council of Canada, Ottawa, ON, Canada
Abstract :
The incorporation of synthetic silica nanoparticles into polypropylene is shown to increase the ac breakdown strength compared to unfilled material. This breakdown strength stays unchanged during application of a 40 kV/mm dc field for up to 500 h at both, room temperature and 90°C. Dielectric spectroscopy shows an increase of dielectric loss factor, tan¿, with nanoflller concentration and a distinct relaxation around 60°C. The increase of tan¿ caused by nanoparticles is moderate and thus manageable in practical applications. Subjecting specimens to a dc field did not significantly change the dielectric loss spectra. The dc conductivity of the materials with nano-filler was found to be higher than for unfilled materials. This is believed to be caused by the overlapping of the diffuse double layers surrounding nanoparticles, which provide a path for the migration of electric charge. Aging nanocomposites in a dc field resulted in the increase of conductivity but the increments were significantly smaller than those observed in the material without organoclay.
Keywords :
ageing; dielectric losses; dielectric relaxation; diffusion; electric breakdown; electric strength; electrical conductivity; filled polymers; nanocomposites; nanoparticles; silicon compounds; SiO2; ac breakdown strength; aging; dc conductivity; dielectric loss factor; dielectric loss spectra; dielectric spectroscopy; diffuse double layers; distinct relaxation; electric charge migration; nanocomposites; nanoflller concentration; polypropylene; synthetic organoclay; synthetic silica nanoparticles; temperature 293 K to 298 K; temperature 90 degC; time 500 h; Conducting materials; Conductivity; Dielectric losses; Dielectric materials; Electric breakdown; Electrochemical impedance spectroscopy; Nanoparticles; Nanostructured materials; Silicon compounds; Temperature;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2009. CEIDP '09. IEEE Conference on
Conference_Location :
Virginia Beach, VA
Print_ISBN :
978-1-4244-4557-8
Electronic_ISBN :
0084-9162
DOI :
10.1109/CEIDP.2009.5377780