Title :
SoaML and UPIA Model Integration for Secure Distributed SOA Clouds
Author :
Maule, R. William
Author_Institution :
Inf. Sci. Dept., Naval Postgrad. Sch., Monterey, CA, USA
Abstract :
The U.S. Department of Defense (DoD) specifies the Department of Defense Architecture Framework (DoDAF) for military architecture models. Industry typically uses different modeling tools, including the Unified Modeling Language. There are many modeling techniques for Service Oriented Architecture (SOA). DoDAF supports SOA through DoDAF version 2.0. Industry supports SOA through several toolsets including UML Profile-based Integrated Architecture (UPIA) and the SOA modeling language (SoaML). This paper presents background information on SOA modeling techniques and some methods to transition between DoD and commercial tools. Variables and metrics for analysis in SOA models are presented. UPIA is advanced as a means to transition between DoDAF 2.0 and SoaML. SoaML is rendered within UPIA models to help address potential future DoD initiatives for implementation of SOA within cloud architectures. This paper advances methods for industry-to-DoDAF model integration for secure distributed SOA clouds and provides background on defense and industry modeling techniques for enterprise-class SOA.
Keywords :
Unified Modeling Language; cloud computing; military computing; security of data; service-oriented architecture; DoDAF; DoDAF version 2.0; SOA modeling language; SoaML model integration; U.S Department of Defense architecture framework; UML profile-based integrated architecture; UPIA model integration; cloud architectures; defense modeling techniques; industry modeling techniques; military architecture models; secure distributed SOA clouds; service oriented architecture; unified modeling language; Computer architecture; Measurement; Modeling; Servers; Service oriented architecture; Unified modeling language; Virtual machining; DoDAF; SOA; SOA-RA; SOA-RM; SoaML; UML; UPIA; modeling; services;
Conference_Titel :
Services (SERVICES), 2012 IEEE Eighth World Congress on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4673-3053-4
DOI :
10.1109/SERVICES.2012.27