DocumentCode :
3052320
Title :
Perspectives on multi-chip modules: substrate alternatives
Author :
Higgins, Leo M., III
fYear :
1992
fDate :
18-20 Mar 1992
Firstpage :
12
Lastpage :
15
Abstract :
A summary of the multichip module (MCM) features commonly mentioned in the literature and by designers, users, and would-be users is given. The current assessment of the many advantages offered by MCM-D indicates the technology will fill the needs of high-performance systems well into the future, but printed wiring board (PWB) modules (MCM-L) can provide solutions now. The rationale for expanded use is discussed. MCM-L represents the most logical substrate technology for use in the current and next-generation personal computers, workstations, and communication equipment. The bulk of these systems will not need the routing density of MCM-D
Keywords :
Bonding; Clocks; Costs; Electronics packaging; Microcomputers; Production systems; Sockets; Thermal management; Wire; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
Type :
conf
DOI :
10.1109/MCMC.1992.201434
Filename :
201434
Link To Document :
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