DocumentCode :
3052726
Title :
Lateral oxidation of AlAs thin films
Author :
Liliental-Weber, Z. ; Richter, O. ; Swider, W. ; Li, M. ; Li, G.S. ; Chang-Hasnain, C. ; Weber, E.R.
Author_Institution :
Div. of Mater. Sci., Lawrence Berkeley Lab., CA, USA
fYear :
1998
fDate :
1998
Firstpage :
227
Lastpage :
230
Abstract :
Transmission electron microscopy was used for characterization of microstructure resulting from wet oxidation of AlAs layers of different thicknesses separated by a 20 nm thick GaAs layer. In general, the oxidation rate was related to the AlAs layer thickness, but some deviation from this rule was observed for layer thicknesses in the range of 65 to 30 nm. Accumulation of As precipitates at the AlAs/GaAs/AlAs interfaces and in the GaAs separation layers was observed. A build up of stress at these interfaces occasionally caused formation of stacking faults close to the oxidation front. Large differences in interface abruptness were observed for direct (AlAs on GaAs) and inverted (GaAs on AlAs) interfaces. The oxidation front was asymmetric with the faster front close to the inverted interface
Keywords :
III-V semiconductors; aluminium compounds; crystal microstructure; interface structure; oxidation; semiconductor thin films; stacking faults; transmission electron microscopy; 20 to 65 nm; AlAs; AlAs layer thickness; AlAs-GaAs-AlAs; As precipitates; interface abruptness; lateral oxidation; microstructure; stacking faults; thin films; transmission electron microscopy; wet oxidation; Crystallization; Gallium arsenide; Laboratories; Materials science and technology; Microstructure; Molecular beam epitaxial growth; Oxidation; Strips; Transistors; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconducting and Insulating Materials, 1998. (SIMC-X) Proceedings of the 10th Conference on
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-4354-9
Type :
conf
DOI :
10.1109/SIM.1998.785113
Filename :
785113
Link To Document :
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