Title :
An integrated approach for electrical performance analysis of multichip modules
Author :
Liao, J.C. ; Choksi, G.N.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
The authors describe an integrated approach to evaluate the electrical performance of multichip modules. A software system consisting of modeling and simulation tools to extract geometry from a placement and routing system, compute electrical parasiticsm, and create equivalent circuit files to perform circuit simulations has been developed. This tool was used in designing an i486 microprocessor-based multichip module. Typical results from the analysis are presented
Keywords :
hybrid integrated circuits; microprocessor chips; modules; MCM; circuit simulations; electrical parasiticsm; electrical performance analysis; equivalent circuit files; geometry; i486 microprocessor-based multichip module; multichip modules; simulation tools; software system; Circuit simulation; Computational modeling; Data mining; Driver circuits; Integrated circuit interconnections; Multichip modules; Performance analysis; Solid modeling; Spatial databases; Timing;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201455