Title :
Design of a silicon-on-silicon multi-chip module for a high-performance Ps/2 workstation
Author :
Pence, W.E. ; McQueeney, D.F. ; Mosley, J.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
A silicon-on-silicon multichip module design, which addresses several issues unique to low-end machines, is described. Among these are mixing bipolar and CMOS chips, practicing flip-chip and wirebonding on the same substrate, and customizing the power plane to supply multiple voltage levels. Following a description of the module design, the issue of performance in microprocessor-based machines as a driver for multichip module technology is discussed
Keywords :
elemental semiconductors; flip-chip devices; hybrid integrated circuits; lead bonding; modules; packaging; silicon; workstations; CMOS chips; Ps/2 workstation; Si; Si on Si MCM; bipolar chips; flip-chip; low-end machines; microprocessor-based machines; multi-chip module; multichip module design; multiple voltage levels; power plane customisation; wirebonding; CMOS logic circuits; CMOS technology; Costs; Microcomputers; Power supplies; Substrates; Transistors; Very large scale integration; Voltage; Workstations;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201460
